Intel E6700 - Core 2 Duo Dual-Core Processor User Manual

Processor Thermal/Mechanical Information
Thermal and Mechanical Design Guidelines 17
Figure 2-2. Processor Case Temperature Measurement Location
37.5 mm
Measure T
C
at this point
(geometric center of the package)
37.5 mm
37.5 mm
Measure T
C
at this point
(geometric center of the package)
37.5 mm
2.2.2 Thermal Profile
The Thermal Profile defines the maximum case temperature as a function of processor
power dissipation. Refer to the datasheet for the further information.
2.2.3 Thermal Solution Design Requirements
While the thermal profile provides flexibility for ATX /BTX thermal design based on its
intended target thermal environment, thermal solutions that are intended to function
in a multitude of systems and environments need to be designed for the worst-case
thermal environment. The majority of ATX /BTX platforms are targeted to function in
an environment that will have up to a 35 °C ambient temperature external to the
system.
For ATX platforms, an active air-cooled design, assumed be used in ATX Chassis, with
a fan installed at the top of the heatsink equivalent to the reference design (see
Chapter 6) should be designed to manage the processor TDP at an inlet temperature
of 35 °C + 5°C = 40 °C.
For BTX platforms, a front-to-back cooling design equivalent to Intel BTX TMA Type II
reference design (see the Chapter 5) should be designed to manage the processor
TDP at an inlet temperature of 35 °C + 0.5 °C = 35.5 °C.
The slope of the thermal profile was established assuming a generational improvement
in thermal solution performance of the Intel reference design. For an example of Intel
Core™2 Duo processor E8000 series with 6 MB in ATX platform, its improvement is
about 15% over the Intel reference design (E18764-001). This performance is
expressed as the slope on the thermal profile and can be thought of as the thermal
resistance of the heatsink attached to the processor, Ψ
CA
(Refer to Section 3.1). The
intercept on the thermal profile assumes a maximum ambient operating condition that
is consistent with the available chassis solutions.

Intel E6700 - Core 2 Duo Dual-Core Processor Specifications

General

Processor Number	E6700
Number of Cores	2
Number of Threads	2
Base Frequency	2.66 GHz
Cache	4 MB L2 Cache
Bus Speed	1066 MHz
TDP	65 W
Socket	LGA 775
Lithography	65 nm
Instruction Set	64-bit
Virtualization Technology	VT-x
Memory Types	DDR2
Release Date	July 2006