Intel E6700 - Core 2 Duo Dual-Core Processor

Thermal and Mechanical Design Guidelines 3
Contents
1 Introduction ...................................................................................................... 9
1.1 Document Goals and Scope ...................................................................... 9
1.1.1 Importance of Thermal Management ............................................ 9
1.1.2 Document Goals ........................................................................ 9
1.1.3 Document Scope ...................................................................... 10
1.2 References ............................................................................................ 11
1.3 Definition of Terms................................................................................. 11
2 Processor Thermal/Mechanical Information .......................................................... 13
2.1 Mechanical Requirements ........................................................................ 13
2.1.1 Processor Package .................................................................... 13
2.1.2 Heatsink Attach ........................................................................ 15
2.1.2.1 General Guidelines ..................................................... 15
2.1.2.2 Heatsink Clip Load Requirement .................................. 15
2.1.2.3 Additional Guidelines .................................................. 16
2.2 Thermal Requirements ........................................................................... 16
2.2.1 Processor Case Temperature ...................................................... 16
2.2.2 Thermal Profile ......................................................................... 17
2.2.3 Thermal Solution Design Requirements ....................................... 17
2.2.4 T
CONTROL
................................................................................... 18
2.3 Heatsink Design Considerations ............................................................... 19
2.3.1 Heatsink Size ........................................................................... 20
2.3.2 Heatsink Mass .......................................................................... 20
2.3.3 Package IHS Flatness ................................................................ 21
2.3.4 Thermal Interface Material ......................................................... 21
2.4 System Thermal Solution Considerations .................................................. 22
2.4.1 Chassis Thermal Design Capabilities ............................................ 22
2.4.2 Improving Chassis Thermal Performance ..................................... 22
2.4.3 Summary ................................................................................ 23
2.5 System Integration Considerations ........................................................... 23
3 Thermal Metrology ............................................................................................ 25
3.1 Characterizing Cooling Performance Requirements ..................................... 25
3.1.1 Example .................................................................................. 26
3.2 Processor Thermal Solution Performance Assessment ................................. 27
3.3 Local Ambient Temperature Measurement Guidelines ................................. 27
3.4 Processor Case Temperature Measurement Guidelines ................................ 30
4 Thermal Management Logic and Thermal Monitor Feature ...................................... 31
4.1 Processor Power Dissipation .................................................................... 31
4.2 Thermal Monitor Implementation ............................................................. 31
4.2.1 PROCHOT# Signal .................................................................... 32
4.2.2 Thermal Control Circuit ............................................................. 32
4.2.2.1 Thermal Monitor ........................................................ 32
4.2.3 Thermal Monitor 2 .................................................................... 33
4.2.4 Operation and Configuration ...................................................... 34
4.2.5 On-Demand Mode ..................................................................... 35