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Intel E6700 - Core 2 Duo Dual-Core Processor User Manual

Intel E6700 - Core 2 Duo Dual-Core Processor
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ATX Thermal/Mechanical Design Information
Thermal and Mechanical Design Guidelines 59
6.5 Safety Requirements
Heatsink and attachment assemblies shall be consistent with the manufacture of units
that meet the safety standards:
UL Recognition-approved for flammability at the system level. All mechanical and
thermal enabling components must be a minimum UL94V-2 approved.
CSA Certification. All mechanical and thermal enabling components must have
CSA certification.
All components (in particular the heatsink fins) must meet the test requirements
of UL1439 for sharp edges.
If the International Accessibility Probe specified in IEC 950 can access the moving
parts of the fan, consider adding safety feature so that there is no risk of personal
injury.
6.6 Geometric Envelope for Intel
®
Reference ATX
Thermal Mechanical Design
Figure 7-40, Figure 7-41, and Figure 7-42 in Appendix G provides detailed reference
ATX/μATX motherboard keep-out information for the reference thermal/mechanical
enabling design. These drawings include height restrictions in the enabling component
region.
The maximum height of the reference solution above the motherboard is 71.12 mm
[2.8 inches], and is compliant with the motherboard primary side height constraints
defined in the ATX Specification revision 2.1 and the microATX Motherboard Interface
Specification revision 1.1 found at http://www.formfactors.org
. The reference solution
requires a chassis obstruction height of at least 81.28 mm [3.2 inches], measured
from the top of the motherboard (refer to Sections 3.3 and 6.2.4). This allows for
appropriate fan inlet airflow to ensure fan performance, and therefore overall cooling
solution performance. This is compliant with the recommendations found in both ATX
Specification V2.1 and microATX Motherboard Interface Specification V1.1 documents.

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Intel E6700 - Core 2 Duo Dual-Core Processor Specifications

General IconGeneral
Processor NumberE6700
Number of Cores2
Number of Threads2
Base Frequency2.66 GHz
Cache4 MB L2 Cache
Bus Speed1066 MHz
TDP65 W
SocketLGA 775
Lithography65 nm
Instruction Set64-bit
Virtualization TechnologyVT-x
Memory TypesDDR2
Release DateJuly 2006

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