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Intel E6700 - Core 2 Duo Dual-Core Processor

Intel E6700 - Core 2 Duo Dual-Core Processor
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Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines 93
Figure 7-22. Third Tape Installation
12. Place a 3
rd
piece of tape at the end of the step in the groove as shown in
Figure 7-22. This tape will create a solder dam to prevent solder from flowing into
the larger IHS groove section during the melting process.
13. Measure resistance from thermocouple end wires (hold both wires to a DMM
probe) to the IHS surface. This should be the same value as measured during the
thermocouple conditioning Section D.5.1.step 3 (Figure 7-23).
Figure 7-23. Measuring Resistance between Thermocouple and IHS

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