Intel E6700 - Core 2 Duo Dual-Core Processor User Manual

Case Temperature Reference Metrology
96 Thermal and Mechanical Design Guidelines
Figure 7-27. Solder Station Setup
21. Remove the land side protective cover and place the device to be soldered in the
solder station. Make sure the thermocouple wire for the device being soldered is
exiting the heater toward you.
Note: Do not touch the copper heater block at any time as this is very hot.
22. Move a magnified lens light close to the device in the solder status to get a better
view when the solder begins to melt.
23. Lower the Heater block onto the IHS. Monitor the device IHS temperature during
this step to ensure the maximum IHS temperature is not exceeded.
Note: The target IHS temperature during reflow is 150 °C ±3 °C. At no time should the IHS
temperature exceed 155 °C during the solder process as damage to the device may
occur.

Intel E6700 - Core 2 Duo Dual-Core Processor Specifications

General

Processor Number	E6700
Number of Cores	2
Number of Threads	2
Base Frequency	2.66 GHz
Cache	4 MB L2 Cache
Bus Speed	1066 MHz
TDP	65 W
Socket	LGA 775
Lithography	65 nm
Instruction Set	64-bit
Virtualization Technology	VT-x
Memory Types	DDR2
Release Date	July 2006