Intel E6700 - Core 2 Duo Dual-Core Processor - Page 4

4 Thermal and Mechanical Design Guidelines
4.2.6 System Considerations .............................................................. 35
4.2.7 Operating System and Application Software Considerations ........... 36
4.2.8 THERMTRIP# Signal .................................................................. 36
4.2.9 Cooling System Failure Warning ................................................. 36
4.2.10 Digital Thermal Sensor .............................................................. 37
4.2.11 Platform Environmental Control Interface (PECI) .......................... 38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ......... 39
5.1 Overview of the BTX Reference Design ..................................................... 39
5.1.1 Target Heatsink Performance ..................................................... 39
5.1.2 Acoustics ................................................................................. 40
5.1.3 Effective Fan Curve ................................................................... 41
5.1.4 Voltage Regulator Thermal Management ...................................... 42
5.1.5 Altitude ................................................................................... 43
5.1.6 Reference Heatsink Thermal Validation ........................................ 43
5.2 Environmental Reliability Testing ............................................................. 43
5.2.1 Structural Reliability Testing ...................................................... 43
5.2.1.1 Random Vibration Test Procedure ................................ 43
5.2.1.2 Shock Test Procedure ................................................. 44
5.2.2 Power Cycling .......................................................................... 45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures ...................... 46
5.3 Material and Recycling Requirements........................................................ 46
5.4 Safety Requirements .............................................................................. 47
5.5 Geometric Envelope for Intel
®
Reference BTX Thermal Module Assembly ...... 47
5.6 Preload and TMA Stiffness ....................................................................... 48
5.6.1 Structural Design Strategy ......................................................... 48
5.6.2 TMA Preload verse Stiffness ....................................................... 48
6 ATX Thermal/Mechanical Design Information ........................................................ 51
6.1 ATX Reference Design Requirements ........................................................ 51
6.2 Validation Results for Reference Design .................................................... 53
6.2.1 Heatsink Performance ............................................................... 53
6.2.2 Acoustics ................................................................................. 54
6.2.3 Altitude ................................................................................... 54
6.2.4 Heatsink Thermal Validation ....................................................... 55
6.3 Environmental Reliability Testing ............................................................. 55
6.3.1 Structural Reliability Testing ...................................................... 55
6.3.1.1 Random Vibration Test Procedure ................................ 55
6.3.1.2 Shock Test Procedure ................................................. 56
6.3.2 Power Cycling .......................................................................... 57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures ...................... 58
6.4 Material and Recycling Requirements........................................................ 58
6.5 Safety Requirements .............................................................................. 59
6.6 Geometric Envelope for Intel
®
Reference ATX Thermal Mechanical Design ..... 59
6.7 Reference Attach Mechanism ................................................................... 60
6.7.1 Structural Design Strategy ......................................................... 60
6.7.2 Mechanical Interface to the Reference Attach Mechanism .............. 61
7 Intel
®
Quiet System Technology (Intel
®
QST) ...................................................... 63
7.1 Intel
®
QST Algorithm .............................................................................. 63
7.1.1 Output Weighting Matrix ............................................................ 64
7.1.2 Proportional-Integral-Derivative (PID) ......................................... 64
7.2 Board and System Implementation of Intel
®
QST ....................................... 66