Intel E6700 - Core 2 Duo Dual-Core Processor

Thermal and Mechanical Design Guidelines 5
7.3 Intel
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QST Configuration and Tuning ........................................................ 68
7.4 Fan Hub Thermistor and Intel
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QST ......................................................... 68
Appendix A LGA775 Socket Heatsink Loading ........................................................................ 69
A.1 LGA775 Socket Heatsink Considerations ................................................... 69
A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel
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Reference Design ................................................................................... 69
A.3 Heatsink Preload Requirement Limitations ................................................. 69
A.3.1 Motherboard Deflection Metric Definition...................................... 70
A.3.2 Board Deflection Limits .............................................................. 71
A.3.3 Board Deflection Metric Implementation Example ......................... 72
A.3.4 Additional Considerations........................................................... 73
A.3.4.1 Motherboard Stiffening Considerations ......................... 74
A.4 Heatsink Selection Guidelines .................................................................. 74
Appendix B Heatsink Clip Load Metrology ............................................................................. 75
B.1 Overview .............................................................................................. 75
B.2 Test Preparation .................................................................................... 75
B.2.1 Heatsink Preparation ................................................................. 75
B.2.2 Typical Test Equipment ............................................................. 78
B.3 Test Procedure Examples ........................................................................ 78
B.3.1 Time-Zero, Room Temperature Preload Measurement ................... 79
B.3.2 Preload Degradation under Bake Conditions ................................. 79
Appendix C Thermal Interface Management .......................................................................... 81
C.1 Bond Line Management .......................................................................... 81
C.2 Interface Material Area ........................................................................... 81
C.3 Interface Material Performance ................................................................ 81
Appendix D Case Temperature Reference Metrology ............................................................... 83
D.1 Objective and Scope............................................................................... 83
D.2 Supporting Test Equipment ..................................................................... 83
D.3 Thermal Calibration and Controls ............................................................. 85
D.4 IHS Groove ........................................................................................... 85
D.5 Thermocouple Attach Procedure ............................................................... 89
D.5.1 Thermocouple Conditioning and Preparation ................................. 89
D.5.2 Thermocouple Attachment to the IHS .......................................... 90
D.5.3 Solder Process ......................................................................... 95
D.5.4 Cleaning and Completion of Thermocouple Installation .................. 98
D.6 Thermocouple Wire Management ........................................................... 102
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations .................. 103
Appendix F Fan Performance for Reference Design .............................................................. 107
Appendix G Mechanical Drawings ....................................................................................... 109
Appendix H Intel
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Enabled Reference Solution Information ................................................... 125