Intel E6700 - Core 2 Duo Dual-Core Processor User Manual

Thermal and Mechanical Design Guidelines 7
Figure 7-27. Solder Station Setup ....................................................................... 96
Figure 7-28. View Through Lens at Solder Station ................................................. 97
Figure 7-29. Moving Solder back onto Thermocouple Bead ..................................... 97
Figure 7-30. Removing Excess Solder .................................................................. 98
Figure 7-31. Thermocouple placed into groove ..................................................... 99
Figure 7-32. Removing Excess Solder .................................................................. 99
Figure 7-33. Filling Groove with Adhesive .......................................................... 100
Figure 7-34. Application of Accelerant ............................................................... 100
Figure 7-35. Removing Excess Adhesive from IHS .............................................. 101
Figure 7-36. Finished Thermocouple Installation ................................................. 101
Figure 7-37. Thermocouple Wire Management .................................................... 102
Figure 7-38. System Airflow Illustration with System Monitor Point Area Identified . 104
Figure 7-39. Thermal sensor Location Illustration ............................................... 105
Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1 ........................................... 110
Figure 7-41. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2 ........................................... 111
Figure 7-42. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3 ........................................... 112
Figure 7-43. BTX Thermal Module Keep Out Volumetric – Sheet 1 ......................... 113
Figure 7-44. BTX Thermal Module Keep Out Volumetric – Sheet 2 ......................... 114
Figure 7-45. BTX Thermal Module Keep Out Volumetric – Sheet 3 ......................... 115
Figure 7-46. BTX Thermal Module Keep Out Volumetric – Sheet 4 ......................... 116
Figure 7-47. BTX Thermal Module Keep Out Volumetric – Sheet 5 ......................... 117
Figure 7-48. ATX Reference Clip – Sheet 1 ......................................................... 118
Figure 7-49. ATX Reference Clip - Sheet 2 ......................................................... 119
Figure 7-50. Reference Fastener - Sheet 1 ......................................................... 120
Figure 7-51. Reference Fastener - Sheet 2 ......................................................... 121
Figure 7-52. Reference Fastener - Sheet 3 ......................................................... 122
Figure 7-53. Reference Fastener - Sheet 4 ......................................................... 123
Figure 7-54. Intel
®
E18764-001 Reference Solution Assembly .............................. 124
Tables
Table 2–1. Heatsink Inlet Temperature of Intel
®
Reference Thermal Solutions .......... 22
Table 2–2. Heatsink Inlet Temperature of Intel
®
Boxed Processor Thermal Solutions . 22
Table 5–1. Balanced Technology Extended (BTX) Type II Reference TMA Performance39
Table 5–2. Acoustic Targets ............................................................................... 40
Table 5–3. VR Airflow Requirements .................................................................... 42
Table 5–4. Processor Preload Limits .................................................................... 49
Table 6–1. E18764-001 Reference Heatsink Performance ...................................... 53
Table 6–2. Acoustic Results for ATX Reference Heatsink (E18764-001) .................... 54
Table 7–1. Board Deflection Configuration Definitions ............................................ 70
Table 7–2. Typical Test Equipment ...................................................................... 78
Table 7–3. Fan Electrical Performance Requirements ........................................... 107
Table 7–4. Intel
®
Representative Contact for Licensing Information of BTX Reference
Design .................................................................................................... 125
Table 7–5. E18764-001 Reference Thermal Solution Providers ............................. 125
Table 7–6. BTX Reference Thermal Solution Providers ......................................... 126

Intel E6700 - Core 2 Duo Dual-Core Processor Specifications

General

Processor Number	E6700
Number of Cores	2
Number of Threads	2
Base Frequency	2.66 GHz
Cache	4 MB L2 Cache
Bus Speed	1066 MHz
TDP	65 W
Socket	LGA 775
Lithography	65 nm
Instruction Set	64-bit
Virtualization Technology	VT-x
Memory Types	DDR2
Release Date	July 2006