Intel Q9450 - Core 2 Quad Quad-Core Processor - Page 4

4 Thermal and Mechanical Design Guidelines
4.2.5 System Considerations.............................................................39
4.2.6 Operating System and Application Software Considerations ...........40
4.2.7 THERMTRIP# Signal.................................................................40
4.2.8 Cooling System Failure Warning ................................................40
4.2.9 Digital Thermal Sensor.............................................................41
4.2.10 Platform Environmental Control Interface (PECI)..........................42
5 Intel
®
Thermal/Mechanical Reference Design Information .....................................43
5.1 ATX Reference Design Requirements .......................................................43
5.2 Validation Results for Reference Design ...................................................45
5.2.1 Heatsink Performance ..............................................................45
5.2.2 Acoustics ...............................................................................46
5.2.3 Altitude..................................................................................47
5.2.4 Reference Heatsink Thermal Validation .......................................47
5.2.5 Fan Performance for Active Heatsink Thermal Solution..................48
5.3 Environmental Reliability Testing ............................................................49
5.3.1 Structural Reliability Testing .....................................................49
5.3.1.1 Random Vibration Test Procedure................................49
5.3.1.2 Shock Test Procedure ................................................49
5.3.1.2.1 Recommended Test Sequence ...............................50
5.3.1.2.2 Post-Test Pass Criteria.............................................50
5.3.2 Power Cycling .........................................................................51
5.3.3 Recommended BIOS/Processor/Memory Test Procedures ..............51
5.4 Material and Recycling Requirements ......................................................51
5.5 Safety Requirements ............................................................................52
5.6 Geometric Envelope for Intel
®
Reference ATX Thermal Mechanical Design ....52
5.7 Reference Attach Mechanism..................................................................53
5.7.1 Structural Design Strategy........................................................53
5.7.2 Mechanical Interface to the Reference Attach Mechanism ..............54
6 Intel
®
Quiet System Technology (Intel
®
QST) .....................................................57
6.1 Intel
®
Quiet System Technology Algorithm...............................................57
6.1.1 Output Weighting Matrix ..........................................................58
6.1.2 Proportional-Integral-Derivative (PID) ........................................58
6.2 Board and System Implementation of Intel
®
Quiet System Technology .......60
6.3 Intel
®
QST Configuration and Tuning.......................................................62
6.4 Fan Hub Thermistor and Intel
®
QST ........................................................62
Appendix A LGA775 Socket Heatsink Loading ......................................................................63
A.1 LGA775 Socket Heatsink Considerations ..................................................63
A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel
®
Reference Design .................................................................................63
A.2.1 Heatsink Preload Requirement Limitations...................................63
A.2.2 Motherboard Deflection Metric Definition.....................................64
A.2.3 Board Deflection Limits ............................................................65
A.2.4 Board Deflection Metric Implementation Example.........................66
A.2.5 Additional Considerations .........................................................67
A.2.5.1 Motherboard Stiffening Considerations .........................68
A.3 Heatsink Selection Guidelines.................................................................68
Appendix B Heatsink Clip Load Metrology............................................................................69
B.1 Overview ............................................................................................69