Thermal and Mechanical Design Guidelines 5
B.2 Test Preparation...................................................................................69
B.2.1 Heatsink Preparation................................................................69
B.2.2 Typical Test Equipment ............................................................72
B.3 Test Procedure Examples.......................................................................72
B.3.1 Time-Zero, Room Temperature Preload Measurement...................73
B.3.2 Preload Degradation under Bake Conditions ................................73
Appendix C Thermal Interface Management.........................................................................75
C.1 Bond Line Management .........................................................................75
C.2 Interface Material Area..........................................................................75
C.3 Interface Material Performance...............................................................75
Appendix D Case Temperature Reference Metrology..............................................................77
D.1 Objective and Scope .............................................................................77
D.2 Supporting Test Equipment....................................................................77
D.3 Thermal calibration and controls.............................................................78
D.4 IHS Groove .........................................................................................79
D.5 Thermocouple Attach Procedure .............................................................84
D.5.1 Thermocouple Conditioning and Preparation ................................84
D.5.2 Thermocouple Attachment to the IHS.........................................85
D.5.3 Solder Process ........................................................................90
D.5.4 Cleaning and Completion of Thermocouple Installation..................93
D.6 Thermocouple Wire Management ............................................................96
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations....................99
Appendix F Mechanical Drawings ..................................................................................... 103
Appendix G Intel
®
Enabled Reference Solution Information .................................................. 123
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