Intel S2600CO Family User Manual

Environmental Limits Specification Intel® Server Board S2600CO Family TPS
Revision 1.0
Intel order number G42278-002
106
11. Environmental Limits Specification
Operation of the server board at conditions beyond those shown in the following table may
cause permanent damage to the system. Exposure to absolute maximum rating conditions for
extended periods may affect long term system reliability.
Table 59. Server Board Design Specifications
Operating Temperature
0º C to 55º C
1
(32º F to 131º F) at product
airflow specification
Non-Operating Temperature
-40º C to 70º C (-40º F to 158º F)
DC Voltage
± 5% of all nominal voltages
Shock (Unpackaged)
Trapezoidal, 35 G, 170 inches/sec
Shock (Packaged)
<20 pounds
>= 20 to <40 pounds
>= 40 to <80 pounds
>= 80 to <100 pounds
>= 100 to <120 pounds
>= 120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged)
5 Hz to 500 Hz 3.13 g RMS random
Note: Chassis design must provide proper airflow to avoid exceeding the Intel
®
Xeon
®
processor maximum
case temperature.
11.1 Processor Thermal Design Power (TDP) Support
To allow optimal operation and long-term reliability of Intel processor-based systems, the
processor must remain within the defined minimum and maximum case temperature (TCASE)
specifications. Thermal solutions not designed to provide sufficient thermal capability may affect
the long-term reliability of the processor and system. The Intel
®
Server board S2600CO4 is
designed to support the Intel
®
Xeon
®
Processor E5-2600 product family TDP guidelines up to
and including 135W. The Intel
®
Server board S2600COE is designed to support the Intel
®
Xeon
®
Processor E5-2600 product family TDP guidelines up to and including 150W with possible
configuration limits.
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel ensures through its own
chassis development and testing that when Intel server building blocks are used together, the
fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel developed server
building blocks to consult vendor datasheets and operating parameters to determine the amount
of airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
11.2 MTBF
The following is the calculated Mean Time Between Failures (MTBF) 30 C (ambient air). These
values are derived using a historical failure rate and multiplied by factors for application,

Intel S2600CO Family Specifications

General

Brand	Intel
Model	S2600CO Family
Category	Server Board
Language	English