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Lenovo ThinkSystem SR665 - Page 10

Lenovo ThinkSystem SR665
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Table 1. Server specifications (continued)
Specification
Description
Processor (depending
on the model)
Up to two AMD
®
EPYC
TM
processors
Designed for Land Grid Array (LGA) 4094 (SP3) socket
Scalable up to 128 cores
Thermal Design Power (TDP): up to 280 watts
For technical rules about processors, see “Technical rules for processor and heat sink” on
page 139.
For a list of supported processors, see:
https://static.lenovo.com/us/en/serverproven/
index.shtml
Memory
Slots: 32 memory module slots
Supported memory module type:
TruDDR4 3200, dual-rank, 16 GB/32 GB/64 GB RDIMM
TruDDR4 3200, dual-rank, 128 GB 3DS RDIMM
Minimum memory:
16 GB using RDIMMs
128 GB using 3DS RDIMMs
Maximum memory:
2 TB using RDIMMs
4 TB using 3DS RDIMMs
Note: The operating speed and total memory capacity depend on the processor model and
UEFI settings.
For a list of supported memory, see the Lenovo ServerProven Web site:
https://static.lenovo.com/us/en/serverproven/index.shtml.
For technical rules for memory modules, see “Technical rules for memory modules” on page
139.
Internal drives Front:
Up to twenty-four 2.5-inch hot-swap SAS/SATA/NVMe drives
Up to twelve 3.5-inch hot-swap SAS/SATA/NVMe drives
Middle/Inside:
Up to eight 2.5-inch hot-swap SAS/SATA/NVMe drives
Up to four 3.5-inch hot-swap SAS/SATAdrives
Up to two internal SATA/NVMe M.2 drives
(On Air baffle or middle drive bays)
Rear:
Up to eight 2.5-inch hot-swap SAS/SATA drives
Up to four 3.5-inch hot-swap SAS/SATA drives
Up to two 7mm hot-swap SATA/NVMe drives
For technical rules for drives, see “Drive bay configurations and requirements” on page 143.
6 ThinkSystem SR665 Setup Guide

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