Processor and heat sink replacement
Use the following procedures to replace an assembled processor and heat sink, known as a processor-heat-
sink module (PHM), a processor, or a heat sink.
Attention: Before you begin replacing a processor, make sure that you have an alcohol cleaning pad (part
number 00MP352). You should use blue thermal grease (part number 01KP765) when replacing the
processor if that grease is available in your country. If it is not available, use gray thermal grease (part number
41Y9292).
Important: The processor in your server can throttle in response to thermal conditions, temporarily lowering
its speed to reduce heat output. In instances where a few processor cores are throttled for an extremely
short time period (100 ms or less), the only indication might be an entry in the operating system event log
with no corresponding entry in the system XCC event log. If this situation occurs, the event can be ignored
and processor replacement is not required.
Remove a processor and heat sink
Processors are in the compute system boards that are accessed from the top of the server. This task has
instructions for removing an assembled processor and heat sink, known as a processor-heat-sink module
(PHM), a processor, and a heat sink. All of these tasks require a Torx T30 driver.
“Read the
installation
Guidelines” on
page 59
“Power off
the server
for this task”
on page 10
“ATTENTION:
Static Sensitive Device
Ground package before opening”
on page 61
Before you remove a PHM:
Note: The heat sink, processor, and processor retainer for your system might be different than those shown
in the illustrations.
1. Read the safety information and installation guidelines (see “Safety” on page iii and “Installation
Guidelines” on page 59).
2. Turn off the server and peripheral devices and disconnect the power cords and all external cables (see
“Power off the server” on page 10).
3. Remove the top cover (see “Remove the top cover” on page 146).
4. Remove the PCIe expansion tray (see “Remove the PCIe expansion tray” on page 149).
5. Remove the system board air baffle (see “Remove the system board air baffle and the power interposer”
on page 128) or the processor and memory expansion tray and the processor and memory expansion
tray air baffle (see “Remove the processor and memory expansion tray” on page 122).
112
ThinkSystem SR860 Maintenance Manual
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