MicroNet CE-507 - Page 56

Optional Feature Modules
Wireless Communication
GDUTUG500/01
CE-500 MDT Hardware Guide
56 / 97
The CE-500 system supports the following Bluetooth communication profiles:
 SPP [Service (Serial) Port Profile]
 LAP (LAN Access Profile, applicable in professional license only)
 PAN (Personal Area Networking) Profile
 GAP (Generic Access Profile) TBD
 GOEP (Generic Object Exchange Profile) TBD

 HCRP (Hardcopy Cable Replacement Profile) TBD
 DUN (Dial-Up Network) Profile TBD
 FTP (File Transfer Profile) TBD
 HID (Human Interface Device) Profile TBD
 HFP (Hands-Free Profile) TBD
 HSP (Headset Profile) TBD
 OPP (Object Push Profile) TBD
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Table 9 – Wireless LAN and Bluetooth Class2 Module Specifications
Functions
Specifications
WLAN Standard
IEEE 802.11b/g, Wi-Fi compliant
Bluetooth Standard
Bluetooth 2.1+EDR (Enhanced Data Rate)
Major Chipset
Marvell 8688
Frequency Range
2.4 GHz ISM radio band
Number of Channels
- 802.11b: USA, Canada and Taiwan – 11
- Most European Countries – 13
- France – 4, Japan – 14
- 802.11g: USA, Canada and Taiwan – 11
- Most European Countries – 13
- Japan – 13
Modulation
- DSSS, OFDM, DBPSK, DQPSK, CCK, 16-
QAM, 64-QAM for WLAN
- GFSK (1Mbps), Π/4 DQPSK (2Mbps) and
8DPSK (3Mbps) for Bluetooth
Output Power
WLAN:
- 802.11b(Ch1~13): typical 15dBm +/- 2dBm
- 802.11b(Ch14): typical 10dBm +/- 2dBm
- 802.11g: typical 12dBm +/- 2dBm