1
OVERVIEW
1.1 Features
1 - 12
1
OVERVIEW
2
SYSTEM
CONFIGURATION
3
GENERAL
SPECIFICATIONS
4
HARDWARE
SPECIFICATIONS OF
THE CPU MODULE
5
POWER SUPPLY
MODULE
6
BASE UNIT AND
EXTENSION CABLE
7
MEMORY CARD AND
BATTERY
8
CPU MODULE START-
UP PROCEDURES
1.1 Features
The Q Series CPU module has the following new features:
(1) Large number of I/O points that can be controlled
The Q Series CPU module supports the following number of actual I/O points
accessible to the I/O modules mounted on the base unit.
(a) Basic model QCPU
• Q00JCPU : 256 points (X/Y0 to FF)
• Q00CPU, Q01CPU : 1024 points (X/Y0 to 3FF)
Up to 2048 points (X/Y0 to 7FF) are supported as the number of I/O device points
usable for refreshing the remote I/O of the CC-Link and link I/O (LX, LY) of the
MELSECNET/H.
(b) High Performance model QCPU
One module can support 4096 points (X/Y0 to FFF).
Up to 8192 points (X/Y0 to 1FFF) are supported as the number of I/O device
points usable for the remote I/O stations in the MELSECNET/H remote I/O
network, the CC-Link data link, and the MELSECNET/MINI-S3 data link.
(c) Process CPU and Redundant CPU
One module can support 4096 points (X/Y0 to FFF).
Up to 8192 points (X/Y0 to 1FFF) are supported as the number of I/O device
points usable for the remote I/O stations in the MELSECNET/H remote I/O
network and CC-Link data link.
(d) Universal model QCPU
• Q02UCPU: 2048points (X/Y0 to 7FF)
• Q03UDCPU, Q04UDHCPU, Q06UDHCPU, Q13UDHCPU, Q26UDHCPU:
4096points (X/Y0 to FFF)
Up to 8192 points (X/Y0 to 1FFF) are supported as the number of I/O device
points usable for the remote I/O stations in the MELSECNET/H remote I/O
network and CC-Link data link.