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NeoDen 7 - Monthly Inspection; Related Issues During Solder Paste Printing Process; Stencil Printing Technology; Inspecting of Solder Paste Printing

NeoDen 7
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Hangzhou NeoDen Technology Co.,Ltd.
37
workable or not.
Checking if the board has been well fixed by magnetic bar and
pins.
3.5.2.2 Monthly Inspection
Items
Detailed Inspection
X/Y axis
Make sure no abnormal noise while placement head moving.
X/Y motor
Make sure X/Y motors no overheating.
Nozzle
Checking if all nozzles are good without bend and nozzle surface is
horizontal
Air hose
Checking the connection between air hose and machine, keep sure
the hose in good situation without wearing or air leaking.
Step motor
Checking if any dirty on step motor, synchronous belt, Synchronous
wheel. Make sure the Z-axis motor can up, down and rotate smoothly.
Z-axis motor
Checking if the placement head can go up and down smoothly. Use
your finger to push the nozzle to check if it moves smoothly. Let each
nozzle head up and down beyond the normal range.
Vacuum pressure
Checking nozzle vacuum pressure. If abnormal, please clean nozzles.
Positive pressure
Checking if the positive pressure normal.
Optical axis
Checking whether it is covered dusk. Please keep it clean and
lubricated
Operation button
Checking each button to make sure they are well-worked
Connector
Checking if well-connected the air hose and air connector.
PCB clamp block
check their wear pattern
3.5.3 Related issues during solder paste printing process
3.5.3.1 Stencil Printing Technology
Screen printing technology refer to using ready-made stencil, directly connect to the printer in
a certain way, make the solder paste evenly flow on the stencil and then leak into the mesh
through the holes. When getting the stencil away, solder paste had been covered to the printed
circuit board solder graphics, then finish the solder paste printing on the PCB.
3.5.3.2 Inspecting of solder paste printing
Printing process is one of the key working procedures to ensure the quality of surface
mounting. According to the statistics, under the premise of guaranteed quality about
components and PCB, correctly PCB design, 70% of the surface quality problem caused
during printing process. In order to ensure the quality of SMT assembly, it is necessary to
strictly control the quality of the solder paste printing.
The amount of solder paste printing requirements are as follows:
(1) The using amount of solder paste should be uniform, good consistency. Solder paste
graphics should be clear, try to avoid adhesion between adjacent graphics. Solder paste

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