Neoway N720 - 2 Application Interfaces; 2.1 Specifications and Pin Definition; 2.2 Pin Description; 2.3 Power Control Interfaces

N720 Hardware User Guide
Copyright © Neoway Technology Co., Ltd iv
2.9.1 FORCE_USB_BOOT ............................................................................................................. 35
3 RF Interface ....................................................................................................................... 36
3.1 2G/3G/4G RF Design and PCB Layout ............................................................................................ 36
3.2 GNSS RF Design and PCB Layout .................................................................................................. 38
3.2.1 GNSS Impedance .................................................................................................................... 38
3.2.2 Active GNSS Antenna Design ................................................................................................. 38
4 Electrical Features and Reliability ............................................................................... 40
4.1 Electrical Features ............................................................................................................................ 40
4.2 Temperature Features ....................................................................................................................... 40
4.3 ESD Features .................................................................................................................................... 41
5 RF Feature ......................................................................................................................... 42
5.1 Operating Band ................................................................................................................................. 42
5.2 TX Power and RX Sensitivity .......................................................................................................... 43
5.3 GNSS Features ................................................................................................................................. 44
6 Mechanical Feature ......................................................................................................... 45
6.1 Dimensions ....................................................................................................................................... 45
6.2 PCB Foot Print ................................................................................................................................. 46
7 Mounting and Packaging ............................................................................................... 47
7.1 Mounting the Module onto the Application Board ........................................................................... 47
7.2 Packaging ......................................................................................................................................... 47
8 SMT Temperature Curve ............................................................................................... 48
9 Abbreviations ................................................................................................................... 49