N720 Hardware User Guide
Copyright © Neoway Technology Co., Ltd 47
7 Mounting and Packaging
7.1 Mounting the Module onto the Application Board
N720 is compatible with industrial standard reflow profile for lead-free SMT process.
The reflow profile is process dependent, so the following recommendation is just a start point guideline:
Only one flow is supported.
Quality of the solder joint depends on the solder volume. Minimum of 0.12 mm to 0.15mm stencil
thickness is recommended.
Use bigger aperture size of the stencil than actual pad size.
Use a low-residue, no-clean type solder paste.
For information about cautions in N720 storage and mounting, refer to Neoway Module Reflow
Manufacturing Recommendations.
When maintaining and manually desoldering it, use heat guns with great opening, adjust the temperature
to 250 degrees (depending on the type of the solder paste), and heat the module till the solder paste is melt.
Then remove the module using tweezers. Do not shake the module in high temperature when removing it.
Otherwise, the components inside the module might get misplaced.
7.2 Packaging
N720 modules are packaged in sealed bags on delivery to guarantee a long shelf life. Package the modules
again in case of opening for any reasons.
If exposed to air for more than 48 hours at conditions not worse than 30 °C/60% RH, a baking procedure
should be done before SMT. Or if the indication card shows humidity greater than 20%, the baking
procedure is also required. Do not bake modules with the package tray directly.
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