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13 General Cooling Recommendations for
Heatsink-less DPU Controllers
This section offers general cooling recommendations to NVIDIA customers who have acquired a
heatsink-less DPU Controller (OPN: 900-9D3C6-00CV-GA0).
Isometric view of the heatsink-less DPU Controller:
Component Side Print Side (with Stiffener)
13.1 General Notes
The Thermal Transfer Plate (TTP) may encompass an internal liquid cooling system within a
cold plate.
The M3 screws maximum protrusion length according to stiffener thread depth is listed
inMechanical Interfaces.
Recommended torque values: M3: 0.35~0.4 Nm. Use a locking mechanism.
To ensure unobstructed access for replacement, ensure that the battery is not blocked. Refer
toEncapsulation and Battery on SFG.
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IMPORTANT NOTES:
The customer holds exclusive responsibility for the thermal design and for ensuring
all board components never exceed their designated thermal operating limits.
The recommendations provided in this section are based on an air-cooled thermal
design.
If the customer's environment has low or no airflow (e.g., liquid cooling) where the
DPU Controller is to be installed, the customer must ensure proper cooling for all the
other board components that are not covered by the recommendations of this
chapter or in the product's thermal model. The customer must guarantee those
components do not exceed their thermal operating limits as well.
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