Nvidia BlueField-3 User Manual

80
5.
•
•
•
•
•
•
When considering encapsulation, ensure there is no interference with the TTP. The
encapsulation is presented as the maximum tolerance on the SFG and is labeled with ENC.
Refer toEncapsulation and Battery on SFG.
13.2 Components that Require Cooling
It is the responsibility of the customer to ensure proper cooling and thermal regulation for all
components on the board. The provided guidelines are minimal and are based on NVIDIA's air-cooling
thermal solution. Note the following:
The DPU controller SoC require contact with TTP on the component side of the product.
Within the air-cooled thermal solution, the cooling of components on the print side of the
DPU controller is achieved via attachment to the board's bottom stiffener with the thermal
interface material. See example in the board print side isometric view above.
The battery's thermal limitation is the maximum ambient temperature of 60°C.
The acceptable pressure on the SoC adheres to the following specifications:
35 psi (SoC area 761.5 mm²).
The center force should be applied at the center of the SoC.
Component Side Print Side (without Stiffener)
Item # Board Components
1 U63
2 U44
3 M1394
4 U99
5 M111-M115, M221-M225, M331-M335, M441-M445
6 U30
7 U66
8 U62

Nvidia BlueField-3 Specifications

General

Product Type	DPU (Data Processing Unit)
Power Consumption	Up to 75W
Manufacturing Process	7nm
Operating Temperature	0°C to 70°C
Virtualization	SR-IOV, Virtio
Target Applications	Cloud, Networking, Storage
Memory	Up to 16 GB DDR4
Memory Bandwidth	Up to 200 GB/s
Networking	Up to 400 GbE
PCIe	PCIe Gen4 x16
Storage Acceleration	NVMe over Fabrics (NVMe-oF)
Security	Hardware root of trust, Secure boot
Form Factor	PCIe Card
Acceleration Engines	Networking, Storage, Security
Software Support	NVIDIA DOCA
Cache	L1, L2, L3 caches