NXP Semiconductors S32R274 - Modular Concept

Introduction
S32R274/372 EVB User Guide, Rev. 0, 08/2018
2 NXP Semiconductors
Table 1. List of acronyms
Acronym
Description
1.25V_SR
Supply voltage from the 1.25 V switching regulator
3.3V_SR
Supply voltage from the 3.3 V switching regulator
5V_LR
Supply voltage from the 5.0 V linear regulator
5V_SR
Supply voltage from the 5.0 V switching regulator
ADC
Analog-to-Digital converter
RESET_B
External signal reset
EVB
Evaluation board
FEC
Fast ethernet controller module
GND
Ground
HV
High voltage (3.3 V and/or 5 V)
LED
Light emitting diode
LV
Low voltage (1.25 V)
MCU
Microcontroller
OSC
Oscillator
P12V
12 V EVB supply power domain
VREG_POR_B
Power-on reset
PWR
Power
RX
Receive
SIPI
Serial Interprocessor Interface
TBD
To be defined
TX
Transmit
VSS
Ground
1.2. Modular concept
For maximum flexibility and simplicity, the EVB has been designed as a modular development
platform. The EVB main board does not contain an MCU. Instead, the MCU is fitted to an MCU
daughter card (occasionally referred to as an adapter board). This approach means that the same EVB
platform can be used for multiple packages and MCU derivatives within the MPC57xx and further
families. High density connectors provide the interface between the EVB and MCU daughter cards as
shown in the diagram below. See section 3.7 for more details on the daughter cards and section 4.8 for
more details on the interface connectors.