Raise3D Pro3 HS Series - Technical Specifications

Raise3D Pro3 HS Series Printer User Manual Technical Specifications
10
B. Technical Specifications
Printer
Pro3 HS
Pro3 Plus HS
Build Volume
(W×D×H)
Single Extruder
Print
Dual Extruder Print
Single Extruder
Print
Dual Extruder Print
300×300×300 mm
255×300×300 mm
300×300×605 mm
255×300×605 mm
Machine Size
(W×D×H)
620×626×760 mm
620×626×1105 mm
Electrical
Power Supply Input
100-240 VAC, 50/60 Hz 230 V @ 3.3 A
Power Supply Output
24 V DC, 600 W
General
Print Technology
FFF
Print Head System
Dual-head with electronic lifting system
Filament Diameter
1.75 mm
XYZ Step Size
0.78125, 0.78125, 0.078125 micron
Print Head Travel Speed
30-300 mm/s
Build Plate
Flexible Steel Plate with BuildTak
Max Build Plate Temperature
120°C
Heated Bed Material
Silicone
Build Plate Leveling
Mesh-leveling with Flatness Detection
Filament Run-out Sensor
Available
Supported Materials
PLA/ ABS/ HIPS/ PC/ TPU/ TPE/ PETG/
ASA/ PP/ PVA/ Nylon/ Glass Fiber
Infused/ Carbon Fiber Infused
Layer Height
0.01–0.25 mm
Nozzle Diameter
V3 Brass Nozzle 0.4 mm (Default), 0.2/
0.6/ 0.8/ 1.0 mm (Available)
Max Nozzle Temperature
300°C
Connectivity
Wi-Fi, LAN, USB port, Live camera
Noise Emission (Acoustic)
＜55 dB (A) when building
Operating Ambient Temperature
15-30°C, 10-90% RH non-condensing
Storage Temperature
-25°C to +55°C, 10-90% RH non-
condensing
Filter
HEPA filter with activated charcoal
EVE Smart Assistant
Available
Software
Slicing Software
ideaMaker
Supported File Types
STL/ OBJ/ 3MF/ OLTP
Supported OS
Windows/ macOS/ Linux
Machine Code Type
GCODE
Printer
Controller
User Interface
7-inch Touch Screen
Network
Wi-Fi, Ethernet
Power Loss Recovery
Available
Screen Resolution
1024×600
Motion Controller
Atmel ARM Cortex-M4 120MHz FPU