Rockwell Automation Publication 2071-UM001E-EN-P - November 2013 25
Install the Kinetix 3 Drive System Chapter 2
Bonding Multiple Subpanels
Bonding multiple subpanels creates a common low impedance exit path for the
high frequency energy inside the cabinet. Subpanels that are not bonded together
can not share a common low impedance path. This difference in impedance can
affect networks and other devices that span multiple panels.
Figure 6 - Multiple Subpanels and Cabinet Recommendations
Wire Braid
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)
Remove paint
from cabinet.
Ground bus
bonded to the
subpanel.
Wire Braid
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)
To Next Page
Loading...
Need help?
General
