60 Rockwell Automation Publication 2071-UM001E-EN-P - November 2013
Chapter 4 Connect the Kinetix 3 Drive
Figure 29 - Chassis Ground Configuration (multiple Kinetix 3 drives on one panel)
Grounding Multiple Subpanels
To ground multiple subpanels, refer to the figure below. HF bonding is not
illustrated. For information, refer to Bonding Multiple Subpanels
on page 25.
Figure 30 - Subpanels Connected to a Single Ground Point
Item Description
1
Chassis ground
2
Bonded ground bar (optional)
3
Bonded cabinet ground bus
4
Ground grid or power distribution ground
2
3
4
Always follow NEC and applicable
local codes.
1
1
1
1
Always follow NEC and
applicable local codes.
Ground Grid or Power
Distribution Ground
Bonded Ground
Bus
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