Planning use
3.3 Mounting the TP 177micro
OP 73micro, TP 177micro (WinCC flexible)
Operating Instructions, 09/2007, 6AV6691-1DF01-0AB0
35
3.3.2 Preparing for mounting
Select the HMI device mounting location
What to observe when selecting the mounting location:
● Position the HMI device so that it is not subjected to direct sunlight.
● Position the HMI device to provide an ergonomic position for the operator and select a
suitable mounting height.
● Ensure that the air vents are not covered as a result of the mounting.
● Observe the permissible mounting positions for the HMI device.
Preparing the mounting cut-out
The degrees of protection are only guaranteed when the following is observed:
● Material thickness at the mounting cut-out: 2 mm to 6 mm
● The deviation from plane for the panel cut-out is ≤ 0.5 mm
This condition must be fulfilled for the mounted HMI device.
● Permissible surface roughness in the area of the seal: ≤ 120 µm (R
z
120)
The figure below shows the required mounting cut-out:
198
142
–1
–1
Figure 3-7 Mounting cut-out for the HMI device
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