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Sony HCD-HP8V - Page 29

Sony HCD-HP8V
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2929
HCD-HP8V
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
• 2 : nonflammable resistor.
• 1 : fusible resistor.
• C : panel designation.
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
f
: internal component.
• : Pattern from the side which enables seeing.
• A : B+ Line.
• B : B– Line.
•Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
∗
: Impossible to measure
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
•Waveforms are taken with a oscilloscope.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : TUNER
J : CD
h : MD
L : VIDEO
E : PB (TAPE)
a : REC (TAPE)
c : DIGITAL OUT
•Abbreviation
E3 : 220-240 V AC area in E model.
EA : Saudi Arabia model.
SP : Singapore model.
TH : Thai model.
• Indication of transistor
B
These are omitted.
CE
Q
C
B
These are omitted.
E
Q
•Waveforms
– BD Board –
1
IC103 qg (RFAC)
(CD Play Mode)
1.05
±
0.3 Vp-p
2
IC103 qh (FE)
(CD Play Mode)
3
IC103 qk (TE)
(CD Play Mode)
4
IC103 wk (RFDCO)
(CD Play Mode)
Approx. 250 mVp-p
Approx. 350 mVp-p
200 mV/DIV, 400 ns/DIV
100 mV/DIV, 20
µ
s/DIV
100 mV/DIV, 20
µ
s/DIV
0.75
±
0.1 Vp-p
200 mV/DIV, 400 ns/DIV
5
IC601 qd (XT2)
3.4Vp-p
30.5
µ
s
1V/DIV,
10
µ
s/DIV
1V/DIV,
40 ns/DIV
3Vp-p
6
IC601 qh (CF2)
125 ns
– PANEL Board –
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
B
These are omitted.
CE
Q
– MAIN Board –
12 Vp-p
13
µ
s
5V/DIV, 4
µ
s/DIV
7 Q207 collector(REC Mode)
B
C
E
These are omitted.
– VMP Board –
3.8 Vp-p
29.5 ns
1V/DIV, 20ns/DIV
8 IC505 <zb/ (XTAO)
2.9 Vp-p
37 ns
1V/DIV, 20ns/DIV
9 IC505 <x/m (CLKB)
Note : The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.

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