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ST L6470H User Manual

ST L6470H
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L6470 Package mechanical data
Doc ID 16737 Rev 2 61/64
10 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Table 56. HTSSOP28 mechanical data
Dim
mm
Min Typ Max
A 1.2
A1 0.15
A2 0.8 1.0 1.05
b0.19 0.3
c0.09 0.2
D
(1)
1. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15 mm per side.
9.6 9.7 9.8
D1 5.5
E 6.2 6.4 6.6
E1
(2)
2. Dimension "E1" does not include interlead flash or protrusions. Interlead flash or protrusions shall not
exceed 0.25 mm per side.
4.3 4.4 4.5
E2 2.8
E0.65
L0.450.60.75
L1 1.0
K0° 8°
Aaa 0.1

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ST L6470H Specifications

General IconGeneral
BrandST
ModelL6470H
CategoryComputer Hardware
LanguageEnglish

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