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Appendix B: System Specications
Appendix B
System Specications
Processors (per node)
Dual Intel Xeon Scalable Family 4th Gen Series Processors (in Socket P+) with a thermal design power (TDP) of up to 270W
and 3 UPIs (UltraPath Interconnect) of up to 11.2 GT/s per node.
Note: Refer to the motherboard specications pages on our website for updates to supported processors.
Chipset
Intel C741
BIOS
AMI BIOS
ACPI 3.0 or later, PCI rmware 4.0 support, BIOS rescue hot-key, SPI dual/quad speed support, riser card auto detection
support, RTC (Real Time Clock) wakeup, and SMBIOS 3.0 or later
Memory (per node)
Supports up to 4TB RDIMM DDR5 (288-pin) ECC memory with speeds up to 4800MT/s in 16 DIMM slots
Storage Drives (per node)
Front hot-swappable drives include:
SYS-221BT-DNTR: Two LFF Gen5 NVME/SATA and 10 LFF Gen4 NVME/SATA
SYS-221BT-DNC8R: Two LFF Gen5 NVME/SAS and 10 LFF Gen4 NVME/SAS
Internal M.2 drives per node include:
Default carrier for two M.2 NVMe Gen 4 SSDs in the 22110 form factor
Optional carrier for two M.2 NVMe Gen 3 SSDs in the 2280 form factor
Internal Connector:
VROC key header
PCI Expansion Slots (per node)
SYS-221BT-DNTR: One PCIe Gen5 LP x16 and two PCIe Gen5 LP x8
SYS-221BT-DNC8R: One PCIe Gen5 LP x16 and one PCIe Gen5 LP x8
Networking (per node)
One AIOM or any compliant OCP 3.0 SFF Network Interface Card
One dedicated LAN port for BMC
Input/Output (per node)
Two USB 3.1 ports
One VGA port
Motherboard (per node)
X13DET-B (WxL) 7.4" x 18.86" (187.96 mm x 479.04 mm)
Chassis
CSE-217BD2-R2K22P; 2U rackmount; (WxHxD) 17.6 x 3.5 x 28.8 in. (449 x 88 x 730 mm)
System Cooling
Four 8-cm mid-chassis fans, two CPU heat sinks per node, and one air shroud per node