6-15
As a further aid in component location, this procedure
specifies the location of most of the components to be
disconnected. The component side of a circuit board is
referred to as the "top" side of the board; the edge
nearest the Front Panel is the front edge. The remaining
sides and edges follow from this orientation.
The exploded view drawing in the ..Replaceable
Mechanical Parts" list at the rear of this manual may be
helpful during the removal and installation of individual
components or subassemblies. Figure 6-2 illustrates the
locations of the circuit boards referred to in this procedure.
Individual circuit boards are illustrated in the "Diagrams"
section of this manual; those illustrations are useful in
location of the components referred to in this procedure.
To avoid electric shock, disconnect the instrument
from the ac power source before removing or replac-
ing any component or assembly.
WARNING
I
Read these instructions completely before attempting
any corrective maintenance.
REMOVAL AND REPLACEMENT
PROCEDURE
7. Clean the area around the solder connection with an
approved flux-removing solvent. Be careful not to remove
any of the printed information from the circuit board.
6. Cut off any excess lead protruding through the cir-
cuit board (if not clipped to the correct length in Step 3).
5. Touch the soldering iron to the connection and apply
enough solder to make a firm solder joint. Do not move
the component while the solder hardens.
4. Insert the leads into the holes of the board so that
the replacement component is positioned the same as the
original component. Most components should be firmly
seated against the circuit board.
3. Bend the leads of the replacement component to fit
the holes in the circuit board. If the component is replaced
while the board is installed in the instrument, cut the leads
so they protrude only a small amount through the reverse
side of the circuit board. Excess lead length may cause
shorting to other conductive parts.
Maintenance-2430 Service
Excessive heat can cause the etched circuit con-
ductors to separate from the circuit board. Never
allow the solder extractor tip to remain at one place
on the board for more than three seconds. Solder
wick, spring-actuated or squeeze-bulb solder suck-
ers, and heat blocks (for desoldering multipin com-
ponents) must not be used. Damage caused by poor
soldering techniques can void the instrument
warranty.
2. When removing a multipin component, especially an
IC, do not heat adjacent pins consecutively. Apply heat to
the pins at alternate sides and ends of the IC as solder is
removed. Allow a moment for the circuit board to cool
before proceeding to the next pin.
Some components are difficult to remove from the
circuit board due to
a
bend placed in the component
leads during machine insertion. To make removal of
machine-inserted components easier, straighten the
component leads on the reverse side of the circuit
board.
NOTE
1. Touch the vacuum desoldering tool to the lead at
the solder connection. Never place the iron directly on the
board; doing so may damage the board.
The following techniques should be used to replace a
component on a circuit board:
Attempts to unsolder, remove, and resolder leads
from the component side of a circuit board may
cause damage to the reverse side of the circuit
board.
Only an experienced maintenance person, proficient
in the use of vacuum-type desoldering equipment
should attempt repair of any circuit board in this
instrument. Many integrated circuits are static sensi-
tive and may be damaged by solder extractors that
generate static charges. Perform work involving
static-sensitive devices only at a static-free work
station while wearing a grounded antistatic wrist
strap. Use only an antistatic vacuum-type solder
extractor approved by a Tektronix Service Center.
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