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Telit Wireless Solutions ML865G1 - Page 72

Telit Wireless Solutions ML865G1
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ML865G1 HW Design Guide
1VV0301632 Rev. 4 Page 72 of 86 2020-09-23
In order to easily rework the ML865G1 is suggested to consider on the application a 1.5
mm placement inhibit area around the module.
It is also suggested, as common rule for an SMT component, to avoid having a mechanical
part of the application in direct contact with the module.
NOTE:
In the customer application, the region under WIRING INHIBIT (see
figure above) must be clear from signal or ground paths.

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