ML865G1 HW Design Guide
1VV0301632 Rev. 4 Page 75 of 86 2020-09-23
Solder paste
Item Lead Free
Solder Paste Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly
Solder Reflow
Recommended solder reflow profile:
WARNING:
The above solder reflow profile represents the typical SAC reflow
limits and does not guarantee adequate adherence of the module to
the customer application throughout the temperature range.
Customer must optimize the reflow profile depending on the overall
system taking into account such factors as thermal mass and
warpage..
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