EasyManua.ls Logo

Telit Wireless Solutions ML865G1 - ML865 G1 PCB Pad Design Recommendations; ML865 G1 PCB Pad Dimensions

Telit Wireless Solutions ML865G1
86 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Loading...
ML865G1 HW Design Guide
1VV0301632 Rev. 4 Page 73 of 86 2020-09-23
PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
PCB pad dimensions
It is not recommended to place via or micro-via not covered by solder resist in an
area of 0.3 mm around the pads unless it carries the same signal of the pad itself
(see following figure).
PCB
Copper Pad
Solder Mask
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)

Table of Contents

Other manuals for Telit Wireless Solutions ML865G1

Related product manuals