ML865G1 HW Design Guide
1VV0301632 Rev. 4 Page 8 of 86 2020-09-23
Solder Reflow ............................................................................... 75
11. PACKAGING ............................................................................... 77
Tray .............................................................................................. 77
Reel .............................................................................................. 79
Moisture sensitivity ....................................................................... 79
12. CONFORMITY ASSESSMENT ISSUES ..................................... 81
ANATEL Regulatory Notices ........................................................ 81
13. SAFETY RECOMMENDATIONS ................................................. 82
READ CAREFULLY ..................................................................... 82
14. ACRONYMS ................................................................................ 83
15. DOCUMENT HISTORY ................................................................ 85
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