Texas Instruments LMX2572EVM - PCB Layer Stack-Up; Top Layer; GND Layer; Power Layer

Top layer
RO4003 (Er = 3.38)
16 mil
GND layer
FR4 (Er = 4.6)
Power layer
FR4 (Er = 4.6)
Bottom layer
62 mil
www.ti.com PCB Layout and Layer Stack-up
15
SNAU217A–August 2017–Revised November 2017
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LMX2572EVM Evaluation Instructions
5 PCB Layout and Layer Stack-up
5.1 PCB Layer Stack-up
The top layer is 1-oz. copper.
Figure 21. PCB Layer Stack-Up
5.2 PCB Layout
Figure 22. Top Layer