Texas Instruments TMS320F28069

25
TMS320F28069 , TMS320F28068 , TMS320F28067 , TMS320F28066
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062
www.ti.com SPRS698F –NOVEMBER 2010–REVISED MARCH 2016
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TMS320F28064 TMS320F28063 TMS320F28062
SpecificationsCopyright © 2010–2016, Texas Instruments Incorporated
(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ
JC
] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(2) lfm = linear feet per minute
5.7 Thermal Resistance Characteristics
5.7.1 PFP PowerPAD Package
°C/W
(1)
AIR FLOW (lfm)
(2)
RΘ
JC
Junction-to-case thermal resistance 9.4 0
RΘ
JB
Junction-to-board thermal resistance 4.6 0
RΘ
JA
(High k PCB)
Junction-to-free air thermal resistance
25.8 0
16.3 150
15.2 250
13.6 500
Psi
JT
Junction-to-package top
0.3 0
0.4 150
0.4 250
0.5 500
Psi
JB
Junction-to-board
4.6 0
4.4 150
4.3 250
4.3 500
(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ
JC
] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(2) lfm = linear feet per minute
5.7.2 PZP PowerPAD Package
°C/W
(1)
AIR FLOW (lfm)
(2)
RΘ
JC
Junction-to-case thermal resistance 9.4 0
RΘ
JB
Junction-to-board thermal resistance 4.4 0
RΘ
JA
(High k PCB)
Junction-to-free air thermal resistance
24.4 0
15.1 150
13.9 250
12.4 500
Psi
JT
Junction-to-package top
0.3 0
0.4 150
0.4 250
0.5 500
Psi
JB
Junction-to-board
4.5 0
4.2 150
4.2 250
4.2 500