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ThinkPad X100e - Page 82

ThinkPad X100e
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Ateverypointintheprocess,besurenottodroporstackthesystemboard.
Ifyouputasystemboarddown,besuretoputitonlyonapaddedsurfacesuchasanESDmator
conductivecorrugatedmaterial.
Note:Thefanassemblyandthebackupbatteryareattachedtothesystemboard.
Foraccess,removetheseFRUsinorder:
“1010Batterypack”onpage54
“1020Bottomdoor”onpage55
“1030Harddiskdrive(HDD)”onpage58
“1080Keyboard”onpage64
“1090Palmrestassembly,power-onboardassembly(withcable),andmicrophone”onpage67
“1100CRTboardassembly(withcable)”onpage72
“1110Speakerassembly”onpage73
“1120I/Oboard(forThinkPadX120e)”onpage74
Table22.Locationofmajorsensitivecomponentsonthesystemboard
Followingcomponentssolderedonthetopsideofthesystemboardareextremelysensitive.Whenyouservice
thesystemboard,avoidanykindofroughhandling.
ForThinkPadX100e
a
AccelerometerchipfortheHDDActiveProtectionSystem™
b
NorthBridge
c
CPU
d
SouthBridge
c
b
a
d
76HardwareMaintenanceManual

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