MAINTENANCE MANUAL
IFR 6000
2-1-1
Page 2
Aug 1/06
C. Visual Inspection
STEP PROCEDURE
1. Inspect Chassis for:
O Tightness of sub-assemblies and chassis mounted connectors.
O Corrosion or damage to metal surfaces.
2. Inspect Capacitors for:
O Loose mounting, deformities or obvious physical damage.
O Leakage or corrosion around leads.
3. Inspect Connectors for:
O Loose or broken parts, cracked insulation and bad contacts.
4. Inspect Circuit Boards for:
O Corrosion or damage to connectors.
O Damage to mounted components including crystals and ICs.
O Freedom from foreign material.
5. Inspect Resistors for:
O Cracked, broken, charred or blistered bodies.
O Loose or corroded soldering connections.
6. Inspect Semiconductors for:
O Cracked, broken, charred or discolored bodies.
O Correct placement and condition of seals around leads.
7. Inspect Wiring for:
O Broken or loose ends and connections.
O Proper dress relative to other chassis parts.
NOTE: Verify wrapped wiring is tight.
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