EasyManuals Logo

Avnet SMARC MSC SM2S-IMX8MINI User Manual

Avnet SMARC MSC SM2S-IMX8MINI
87 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Page #20 background image
MSC SM2S-IMX8MINI 20 / 87
User Manual
1.6 Mechanical Distortion of PCB
For thermal heat dissipation the heat sink needs to have a good mechanical contact to the CPU housing which means the heat sink should be mounted
such that there is some mechanical stress applied. The higher the force applied the better the thermal resistance and consequently the better the
thermal cooling. This pressure may result in a slight mechanical bending of the SMARC module PCB.
Production tolerance, material deviation and thermal expansion lead to a range of possible pressure range and bending. A negative pressure with an
air gap between the heat spreader and the chip case needs to be avoided and likewise too much distortion.
Component types and their distance to the heat spreader mounting holes need to be considered.
Referring to data sheets of the relevant parts and referring to AEC-Q200 the bending needs to be less than 1mm over 90mm. (1.11%) 0.75mm
Figure 1-4: Distance between mounting holes
68mm

Questions and Answers:

Question and Answer IconNeed help?

Do you have a question about the Avnet SMARC MSC SM2S-IMX8MINI and is the answer not in the manual?

Avnet SMARC MSC SM2S-IMX8MINI Specifications

General IconGeneral
BrandAvnet
ModelSMARC MSC SM2S-IMX8MINI
CategoryControl Unit
LanguageEnglish

Related product manuals