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d) The height of IC tray should not be exceeded, refer to section “Run”.
(4) Place PCB: Place PCB with solder paste to PCB clamp area.
(5) Install nozzle: Different model of nozzles are introduced below.
a) 502 is suitable for mounting footprint of 0402.
b) 503 is suitable for mounting footprint of 0603.
c) 504 is suitable for mounting footprint of 0805,1206,SOT23, etc.
d) 505 is suitable for mounting footprint of SOP8,SOP14, etc.
e) 506 is suitable for mounting footprint of QFN,TQFP, etc.
Figure.12- 4
(6) Edit material stack: Calibrate position of material stack, refer to section
“Run”-“Material Stack” for details.
Figure.12- 5
(7) PCB Calibration: E.g. calibrating PCB by components, see figure below, refer to
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