Table 2. Product specifications (continued)
Features Specification
M.2 form factors (all densities) 2280–S3–B-M
Performace
● Seq R/W: Up to 1350/290 MS/s
● QD4 4HB Random Read: 240K + IOPs
● QD4 4HB Random Write: 240K + IOPs
Latency (average sequential)
● Read 8.25 µ
● Write: 30 µ
Components
● Intel 3D XPoint Memory Media
● Intel Controller and Firmware
● PCIe 3.0x2 with NVMe Interface
● Intel Rapid Storage Technology 15.2 or later
Operating System Support Windows 10 64 bit
Supported Platforms 7th generation or newer Intel Core processor based platforms
Power
● 3.3V Supply Rail
● Active: 3.5 W
● Drive Idel :900mW to 1.2W
Compliance
● NVMe Express 1.1
● PCI Express Base specifiation rev 3.0
● PCI M.2 HS Spec
Certification and Declarationsµ UL, CE, C-Tick, BSMI, KCC, Microsoft WHQL, Microsoft
WHCK, VCCI
Endurance Rating
● 100 GB Writes per day
● Upto 182.3 TBW (Terabytes written)
Temperature Specification
● Operating: 0 to 70º C
● Non-Opearting: 10 to 85º C
● Temperature monitoring
Shock 1500 G/0.5msec
Vibration
● Operating: 2.17 G
RMs
(5–800Hz)
● Non-Operating: 3.13 G
RMS
(5–800Hz)
Altitude (Simulated)
● Operating: –1,000 ft to 10,000 ft
● Non-Operating: –1,000 ft to 40,000 ft
Product Ecological Compliance RoHS
Reliability
● Uncorrectable Bit Error Rate (UBER): 1 sector per 10
15
bits
read
● Mean Time Between Failure (MTBF): 1.6 million hours
Environmental Conditions
Table 3. Temperature, Shock, Vibration
Temperature M.2 2280 form factor
Operating
1
Non-operating
2
0–70º C
-10–85º C
Temperature Gradient
3
Operating
30º C/hr (Typical)
M.2 Intel Optane Memory Module 16 GB 43
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