Digi Connect ME Hardware Reference

Mechanical Specifications
53
Additional Design Recommendations
The following list provides additional design guidance with respect to thermal management in
applications with operating temperatures at the high end or beyond the specified standard ambient
temperature range.
 Providing air movement will improve heat dissipation.
 The host PCB plays a large part in dissipating the heat generated by the module. A large
copper plane located under the Digi Connect ME 9210 is soldered to the module’s mounting
tabs will improve the heat dissipation capabilities of the PCB.
 If the design allows, added buried PCB planes will also improve heat dissipation. The copper
planes create a larger surface to spread the heat into the surrounding environment.
 Adding a thermal pad or thermal compound, such as Sil-Pad
®
, Gap Pad
®
or Gap Filler
products made by the Bergquist Company (www.bergquistcompany.com), between the host
PCB and the underside of the module will significantly increase the thermal transfer between
the module’s enclosure and the host PCB. Limit the fill area to the folded metal portion of the
module’s underside.
Mechanical Specifications
Bar Code
The 50m PN is code 3 of 9 (39) and the MAC is code 128. All scanners are set up so if they read
code 3 of 9 they will automatically read 128. The reason for the two different code types is to
maximize the size of the bars within a given space to improved readability.
Dimensions
Digi Connect
ME
Digi Connect
Wi-ME
Length
1.445 in.
(36.703 mm)
1.85 in
(46.99 mm)
Width 0.75 in. (19.05 mm)
Height 0.854 in. (21.69 mm)
Weight
.616oz.
17.463g
.696 oz.
19.731 g.
Antenna:.408 oz.
11.567 g
Total: 1.104 oz.
31.298 g
Device/serial
interface connector
20-pin micro header (10-pin double row) with .05-inch (1.27-mm) pitch (Samtec
P/N FTS-110-01-F-DV-TR or similar). Positions 3 through 6 are removed.

Digi Connect ME Specifications

General

Brand	Digi
Model	Connect ME
Category	Network Hardware
Language	English