HP 54 Basic Cutter loading positions
Position Substrate width in mm (inches) Margin width in mm (inches)
1 1372 (54) 24 (1.0)
2 1220 (48) 23 (0.9)
3 1000 (40) 23 (1.2)
4 914 (36) 25 (1.0)
5 762 (30) 21 (0.8)
6 610 (24) 20 (0.8)
7 500 (20) 23 (1.1)
8 400 (16) 25 (1.1)
9 280 (11) 10 (0.4)
10 * 105 (4.1) 10 (0.4)
* Position 10 is at the extreme right, not shown in the illustration below. The substrate sensor should be
disabled when using this position.
7. Position the pinch rollers over the drive sleeves about 3 to 15 mm (0.1 to 0.6 in) away from the substrate’s
outer edges (1). Then pull the substrate while holding the ange at the back, so that the substrate is tight.
If this procedure does not work, because the substrate is too narrow to reach the long drive sleeve, position
the left substrate edge over the second left drive sleeve and position the right substrate edge somewhere
over the long drive sleeve. Continue moving the left pinch roller towards the long drive sleeve until both
pinch rollers are in their designated position and directly over the edges of the vinyl.
In all cases, both edges of the substrate must cover a drive sleeve. If this is not the case, reposition the roll
to cover the drive sleeve.
14 Chapter 3 Load the substrate ENWW
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