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HP ProDesk 400 G7 SFF

HP ProDesk 400 G7 SFF
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2. Lift to remove the hood sensor module (2) from the system chassis.
To install the hood sensor module, reverse the removal procedures.
Memory modules (DIMMs)
To remove the memory modules, use this information and procedures.
Table
4-1 Memory module descriptions
Description
Memory module (UDIMM, 1.2 V, DDR4-3200, NECC)
32 GB
16 GB
8 GB
4 GB
Memory module (UDIMM, 1.2 V, DDR4-2666, NECC)
32 GB
16 GB
8 GB
4 GB
The memory sockets on the system board are populated with at least one preinstalled memory module. To
achieve the maximum memory support, you can populate the system board with up to 128 GB of memory
congured in a high-performing dual-channel mode.
For proper system operation, the DIMMs must adhere to the following specications:
Industry-standard 288-pin
Unbuered non-ECC PC4-19200 DDR4-2666/3200 MHz-compliant
ENWW Memory modules (DIMMs) 25

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