A Specifications
Mechanical specifications
The following table lists the mechanical specifications of the HP XP7 disk array.
Table 23 HP XP7 mechanical specifications
Dual ModuleSingle ModuleSingle RackDimension
(6 racks)(3 racks)
142 / 361071.3 / 181024.0 / 610Width (inches / mm)
45 / 114545 / 114545 / 1145Depth (inches / mm)
79 / 200679 / 200679 / 2006Height (inches / mm)
7500 / 34023750 / 17011120 / 508 (Diskless)Min (lbs / kg)System
Weight
8560 / 38834319 / 19591558 / 707Max (lbs / kg)
Rack Weight is included in system weight292.6 / 133(lbs / kg)Rack
Weight
Electrical specifications
The HP XP7 supports single-phase and three-phase power. Power consumption and heat dissipation
is independent of input power.
“System heat and power specifications” (page 78) lists system heat and power specifications.
“System components heat and power specifications ” (page 79) lists component heat and power
specifications.
“AC power - PDU options” (page 80) lists the PDU specifications for both single phase and three
phase power.
System heat and power specifications
Table 24 System heat and power specifications
Full Array (DKC-0
plus DKC-1 plus
DKU x4)DKU RackDKC Module-1DKC Module-0
Parameter
1, 2
33.15.455.425.87Max Power
consumption (kVA)
Heat Dissipation
and Power
Consumption
31.45.175.155.57Max Heat
dissipation (kW)
Specifications
(Maximum
configuration)
107155176431757119012Max BTUs per
hour
27002444644284791Max Kcal per hour
1
Heat (KW, BTU, Kcal) and Power (kVA) values are for determining load for site planning. Actual heat generation
and power demand may be less.
2
Calculated values with drives at a typical I/O condition. (Random Read and Write, 50 IOPSs for HDD, 2500 IOPSs
for SSD, Data Length: 8Kbytes). These values may increase for future compatible drives.
78 Specifications