Product Description
31
1.10 Audio Subsystem
The board supports the Intel High Definition audio subsystem based on the
SigmaTel 9274D or the SigmaTel 9227 audio codec. The audio subsystem supports
the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to user’s definition, or can be
automatically switched depending on the recognized device type.
• Stereo input and output for all back panel jacks
• Line out and Mic in functions for front panel audio jacks
• A signal-to-noise (S/N) ratio of 90 dB
1.10.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, page 17
1.10.2 Audio Connectors
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio connectors include the
following:
• Front panel audio (a 2 x 5-pin header that provides mic in and line out signals for
front panel audio connectors)
• ATAPI CD-ROM (an optional 1 x 4-pin ATAPI-style connector for connecting an
internal ATAPI CD-ROM drive to the audio mixer)
The functions of the back panel audio connectors are dependent on which subsystem is
present. The 8-channel (7.1) audio subsystem is described in Section
1.10.3; the
6-channel (5.1) audio subsystem is described in Section
1.10.4.
For information about Refer to
The locations of the front panel audio header and the optional ATAPI
CD-ROM connector
Figure 20, page 59
The signal names of the front panel audio header Table 18, page 61
The signal names of the optional ATAPI CD-ROM connector Table 17, page 61
The back panel audio connectors Section 2.7.1, page 56
To Next Page
Loading...
Need help?
General
