Intel Desktop Board D975XBX2 Technical Product Specification
78
Table 35 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 35. Thermal Considerations for Components
Component Temperature
Intel 82801G ICH7-R/ICH7-DH 110
o
C (under bias)
Intel
82975X MCH 99
o
C (under bias)
Processor For processor case temperature, see processor datasheets and
processor specification updates
Processor voltage regulator area 120
o
C (under bias)
NOTE
For hardware monitoring application software, an alert point of 110
o
C is recommended
as a starting point for the processor voltage regulator area.
For information about Refer to
Intel Pentium 4 processor datasheets and specification updates Section 1.2, page 17
2.12 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is
99,721 hours.
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