13 
1  Product Description 
1.1  Overview 
1.1.1  Feature Summary 
Table 2 summarizes the major features of the board. 
Table 2.  Feature Summary 
Form Factor 
Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters]) 
Processor 
•  Intel
®
 Core i7, Intel
®
 Core™ i5, Intel
®
 Core™ i3, Intel
®
 Pentium
®
, Intel
®
 
Celeron
®
, and Intel
®
 Xeon
®
 processors in an LGA1155 socket with up to 65 W 
TDP:   
―  Integrated graphics processing (processors with Intel
®
 Graphics 
Technology) 
―  Integrated PCI Express* v2.0 interface controller 
―  Integrated memory controller 
Memory  
•  Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module 
(SO-DIMM) sockets 
•  Support for DDR3 1333 MHz and DDR3 1066 MHz SO-DIMMs 
•  Support for 1 Gb, 2 Gb, and 4 Gb memory technology 
•  Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb 
memory technology 
•  Support for non-ECC memory 
•  Support for 1.35 V low voltage JEDEC memory 
Chipset 
Intel
®
 
H61 Express Chipset consisting of the Intel
®
 H61 Express Platform 
Controller Hub (PCH) 
Graphics 
•  Integrated graphics support for processors with Intel Graphics Technology: 
―  High Definition Multimedia Interface* (HDMI*) 
―  DVI-I 
―  Internal flat panel displays: 
  LVDS 
  eDP (Embedded DisplayPort*) 
Audio 
•  10-channel (8+2) Intel
®
 High Definition (Intel
®
 HD) audio via the Realtek* 
ALC892 audio codec 
―  Digital/analog stereo line-out (2-in-1 digital/analog back panel jack) 
―  In-chassis stereo speakers support (3 W/4 Ω via internal header) 
―  AV-compliant 7.1 (see note on page 32) surround support (analog line-level 
via internal header) 
―  Secondary S/PDIF digital audio output (internal header) 
―  DMIC digital microphone input (internal header) 
―  Analo
g line-in (back panel jack) 
―  Front panel HD Audio/AC’97 headphones/mic support (internal header) 
•  8-channel (7.1) Intel High Definition Audio via the HDMI interface 
continued