13
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor
Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])
Processor
• Intel
®
Core i7, Intel
®
Core™ i5, Intel
®
Core™ i3, Intel
®
Pentium
®
, Intel
®
Celeron
®
, and Intel
®
Xeon
®
processors in an LGA1155 socket with up to 65 W
TDP:
― Integrated graphics processing (processors with Intel
®
Graphics
Technology)
― Integrated PCI Express* v2.0 interface controller
― Integrated memory controller
Memory
• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module
(SO-DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz SO-DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
Chipset
Intel
®
H61 Express Chipset consisting of the Intel
®
H61 Express Platform
Controller Hub (PCH)
Graphics
• Integrated graphics support for processors with Intel Graphics Technology:
― High Definition Multimedia Interface* (HDMI*)
― DVI-I
― Internal flat panel displays:
LVDS
eDP (Embedded DisplayPort*)
Audio
• 10-channel (8+2) Intel
®
High Definition (Intel
®
HD) audio via the Realtek*
ALC892 audio codec
― Digital/analog stereo line-out (2-in-1 digital/analog back panel jack)
― In-chassis stereo speakers support (3 W/4 Ω via internal header)
― AV-compliant 7.1 (see note on page 32) surround support (analog line-level
via internal header)
― Secondary S/PDIF digital audio output (internal header)
― DMIC digital microphone input (internal header)
― Analo
g line-in (back panel jack)
― Front panel HD Audio/AC’97 headphones/mic support (internal header)
• 8-channel (7.1) Intel High Definition Audio via the HDMI interface
continued