Intel EM64T - Celeron D 336 Boxed Ena User Manual

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4 Thermal/Mechanical Design Guide
4.2.4 On-Demand Mode ................................................................................34
4.2.5 System Considerations......................................................................... 34
4.2.6 Operating System and Application Software Considerations............... 35
4.2.7 On-Die Thermal Diode.......................................................................... 35
4.2.7.1 Reading the On-Die Thermal Diode Interface..................... 35
4.2.7.2 Correction Factors for the On-Die Thermal Diode .............. 36
4.2.8 THERMTRIP# Signal............................................................................ 37
4.2.8.1 Cooling System Failure Warning......................................... 37
5 Intel
®
Thermal/Mechanical Reference Design Information............................................... 39
5.1 Intel Validation Criteria for the Reference Design................................................ 39
5.1.1 Heatsink Performance Target............................................................... 39
5.1.2 Acoustics............................................................................................... 40
5.1.3 Altitude .................................................................................................. 40
5.1.4 Reference Heatsink Thermal Validation ............................................... 41
5.1.5 Fan Performance for Active Heatsink Thermal Solution ...................... 41
5.2 Environmental Reliability Testing ......................................................................... 42
5.2.1 Structural Reliability Testing ................................................................. 42
5.2.1.1 Random Vibration Test Procedure...................................... 42
5.2.1.2 Shock Test Procedure......................................................... 42
5.2.1.2.1 Recommended Test Sequence........................... 43
5.2.1.2.2 Post-Test Pass Criteria ....................................... 43
5.2.2 Power Cycling ....................................................................................... 44
5.2.3 Recommended BIOS/Processor/Memory Test Procedures................. 44
5.3 Material and Recycling Requirements ................................................................. 44
5.4 Safety Requirements............................................................................................ 45
5.5 Geometric Envelope for ATX Intel
®
Reference Thermal Mechanical Design ...... 45
5.6 ATX Reference Thermal Mechanical Solution for the Intel
®
Pentium
®
4 Processor
in the 775–Land LGA Package ............................................................................
46
5.7 Reference Attach Mechanism .............................................................................. 48
5.7.1 Structural Design Strategy.................................................................... 48
5.7.2 Mechanical Interface to the Reference Attach Mechanism .................. 49
6 Acoustic Fan Speed Control ............................................................................................. 53
6.1 Acoustic Fan Speed Control................................................................................. 53
6.2 Thermal Solution Design ...................................................................................... 53
6.2.1 Compliance to Thermal Profile ............................................................. 53
6.2.2 Determine Thermistor Set Points.......................................................... 53
6.2.3 Minimum Fan Speed Set Point ............................................................. 54
6.3 Board and System Implementation ...................................................................... 55
6.3.1 Choosing Fan Speed Control Settings ................................................. 55
6.3.1.1 Temperature to begin Fan Acceleration.............................. 56
6.3.1.2 Minimum PWM Duty Cycle.................................................. 58
6.4 Combining Thermistor and Thermal Diode Control .............................................59
6.5 Interaction of Thermal Profile and T
CONTROL
......................................................... 59
Appendix A LGA775 Socket Heatsink Loading.................................................................................... 61
A.1 LGA775 Socket Heatsink Considerations ............................................................ 61
A.2 Metric for Heatsink Preload for ATX/µATX Designs Non-Compliant with Intel
Reference Design.................................................................................................
61
A.2.1 Heatsink Preload Requirement Limitations .......................................... 61

Intel EM64T - Celeron D 336 Boxed Ena Specifications

General

Brand	Intel
Model	EM64T - Celeron D 336 Boxed Ena
Category	Computer Hardware
Language	English