Intel EM64T - Celeron D 336 Boxed Ena User Manual

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Thermal/Mechanical Design Guide 5
A.2.2 Motherboard Deflection Metric Definition ............................................. 62
A.2.3 Board Deflection Limits......................................................................... 63
A.2.4 Board Deflection Metric Implementation Example................................ 64
A.2.5 Additional Considerations ..................................................................... 65
A.2.5.1 Motherboard Stiffening Considerations............................... 65
A.3 Heatsink Selection Guidelines ............................................................................. 66
Appendix B Heatsink Clip Load Metrology ........................................................................................... 67
B.1 Overview............................................................................................................... 67
B.2 Test Preparation................................................................................................... 67
B.2.1 Heatsink Preparation ............................................................................ 67
B.2.2 Typical Test Equipment ........................................................................ 70
B.3 Test Procedure Examples .................................................................................... 70
B.3.1 Time-Zero, Room Temperature Preload Measurement ....................... 71
B.3.2 Preload Degradation under Bake Conditions ....................................... 71
Appendix C Thermal Interface Management........................................................................................ 73
C.1 Bond Line Management ....................................................................................... 73
C.2 Interface Material Area ......................................................................................... 73
C.3 Interface Material Performance ............................................................................ 73
Appendix D Case Temperature Reference Metrology .........................................................................75
D.1 Objective and Scope ............................................................................................ 75
D.2 Definitions............................................................................................................. 75
D.3 Supporting Test Equipment.................................................................................. 76
D.4 Thermal Calibration and Controls ........................................................................ 77
D.5 IHS Groove........................................................................................................... 77
D.6 Thermocouple Attach Procedure ......................................................................... 80
D.6.1 Thermocouple Conditioning and Preparation....................................... 80
D.6.2 Thermocouple Attachment to the IHS .................................................. 80
D.6.3 Curing Process ..................................................................................... 84
D.7 Thermocouple Wire Management........................................................................ 86
Appendix E Board Level PWM and Fan Speed Control Requirements ............................................... 87
Appendix F Balanced Technology Extended (BTX) System Thermal Considerations ........................ 91
Appendix G Mechanical Drawings........................................................................................................ 93
Appendix H Intel Enabled Reference Solution Information ................................................................ 105

Intel EM64T - Celeron D 336 Boxed Ena Specifications

General

Brand	Intel
Model	EM64T - Celeron D 336 Boxed Ena
Category	Computer Hardware
Language	English