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6 INSTALLATION AND WIRING
6.3 Installation Environment and Installation Position
6.3 Installation Environment and Installation Position
Installation environment
Installation location
Do not install the I/O module to the following environment:
■I/O module (except for waterproof module)
• Ambient temperature is outside the range from 0 to 55;
• Ambient humidity is outside the range from 5 to 95% RH;
• Condensation occurs due to rapid temperature change;
• Corrosive gas or combustible gas is present;
• Conductive powder such as dust and iron powder, oil mist, salinity, or organic solvent is filled;
• The I/O module is exposed to direct sunlight;
• A strong electric field or strong magnetic field is generated; and
• The I/O module is subject to vibration and shock.
■I/O module (waterproof module)
• Ambient temperature is outside the range from 0 to 55;
• IP67 is not satisfied;
• Condensation occurs due to rapid temperature change;
• Corrosive gas or combustible gas is present;
• Conductive powder such as dust and iron powder, oil mist, salinity, or organic solvent is filled;
• The I/O module is exposed to direct sunlight;
• A strong electric field or strong magnetic field is generated; and
• The I/O module is subject to vibration and shock.
Installation surface
Install the I/O module on the flat surface. When the installation surface is uneven, excessive force is applied to the printed-
circuit board and may cause a defect.
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